Rigid Flex PCB Manufacturer Process and What You Should Know

Rigid-Flex PCBs are becoming increasingly common, thanks to their dynamic nature and ability to adapt to various environments. They also have a high degree of durability and can resist harsh chemicals and extreme temperatures. These characteristics make them a must-have for many industries, including aerospace, manufacturing, and the military. However, like any other electrical component, they must be fabricated with the highest standards possible to ensure reliability and performance. This means that the fabrication process must be carefully executed and monitored, right from planning, design, and material selection to manufacturing and testing. A slight flaw in any of these steps can drastically affect the overall quality and function of the final product.

To achieve these pristine results, rigid-flex circuit boards must be made using the best materials and processes possible. This ensures a reliable and efficient product that will be able to withstand the most difficult conditions without suffering any damage. In order to guarantee this, it is important to partner with a reliable rigid-flex PCB manufacturer that has the necessary experience and resources. Here are some tips to help you select the right one:

Start by checking the fabricator’s certifications and standardizations. Then, review client testimonials and ratings. You should be able to determine whether or not the company will deliver the best results by reading through these reviews. If there are any negative comments, you can take note of them and avoid working with that supplier in the future.

Once you’ve found a potential rigid-flex supplier, you should proceed with a comprehensive and detailed agreement. This is essential for ensuring that both parties are on the same page and will have no problems in the future. Then, you can move forward with the project.

The Rigid Flex PCB Manufacturer Process and What You Should Know

The first step in the rigid flex pcb manufacturer fabrication process is base preparation. The copper laminate, which is either adhesive-backed or adhesiveless, is cleaned thoroughly. During this phase, copper coils may have anti-tarnish coatings, which must be removed. This step also involves micro-etching the copper to compensate for any isotropic losses in the manufacturing process.

Cover lay lamination is the next step in the process. It is used to protect the top and bottom sides of the flex circuit from environmental stressors, harsh chemicals, and solvents. This layer can be deposited via spray or screen printing and is then cured by UV exposure. If the flex circuit requires components mounted on specific sections, an additional photo-imageable solder mask is applied. For coarser cheaper designs, this can be done with screen printing as well.

After the base and coverlay layers are applied, the etching process begins. The etched copper is then cut to shape with a number of different drilling processes. For holes and vias larger than 1 mm, high speed laser drills are usually used. For smaller holes, excimer YAG and CO2 lasers are the preferred method.

A final finish is then applied to the pads and vias, which helps protect them from contamination and oxidation. The finishing process may include an organic solderability preservative or a conformal coating, depending on the requirements of your application. Electrical testing and verification are then performed as per IPC-ET-652 guidelines. This can include in-circuit testing (ICT), flying probe, and boundary scan, as well as automated optical inspection (AOI).